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Packaging of RF and Microwave devices

21/03/2012

Edinburgh

IMAPS- UK presents a one day workshop on the topic of Packaging of RF and Microwave devices.


Papers are sought for consideration for both oral and poster presentation in the areas of:
 • Emerging technologies
 • Design and Materials
 • RF Simulation and Modelling Case-studies and Techniques
 • New and Novel applications
 • Reliability and test
Abstracts of 100 words should be submitted to events@imaps.org.uk no later than the 10th of February.”
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