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International Microelectronics and Packaging Society IMAPS 2010

31/10/2010 - 04/11/2010

Raleigh Convention Centre, Research Triangle, North Carolina Courtesy: www.zdnet.com/.../ 1344

The 43rd international symposium on microelectronics covering systems, applications, design and materials will addressthermal and power management, cost reduction, outsourcing and supply chain management, electromagnetic Interference (EMI), sensors and nano packaging, systems packaging, 3D system intergration, microwave and emerging technologies.

Two of the keynote speakers will be John Edmond & Dr Rao Tummala.

John Edmond co-founded Cree Research, Inca nd has worked on the development and production of blue and green LEDs, first in silicon carbide, then in the Group III Nitrides on SiC. In July 2007, Edmond earned a place on Business 'CEO's Who Matter Now' list, a distinction placing him alongside celebrities such as Apple's Steve Jobs and the chiefs of Amazon, Cisco and Google. He graduated summa cum laude from Alfred University in 1983 with a Bsc in Ceramic Engineering and PhD in Materials.  



Dr. Rao Tummala is a Distinguished and Endowed Chair Professor, and Founding Director of NSF ERC at Georgia Tech, the largest Academic Center in Microsystems pioneering System-On-Package (SOP) vision. Prior to joining Georgia Tech, he was an IBM Fellow, pioneering major technologies as the first plasma flat panel display based on gas discharge, the first and next three generations of multichip packaging: alumina, glass-ceramic-copper and copper-polymer thin film: and materials for ink-jet printing and magnetic storage.

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